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apu1c cooling assembly
The apu CPU and south bridge (apu1) or apu2 CPU (single chip) are passively cooled by heat conduction to the bottom of the enclosure. This assumes use of our enclosure. Third party enclosures should work if they are made from aluminium, and have a board standoff height of 5 mm. Based on our measurements, at full load the CPU runs a few degrees cooler in the black (case1d2blku) or red (case1d2redu) enclosures, compared to the plain anodized enclosure (case1d2u). There is a reason why heat sinks are usually black - better emissivity.
Remove DB9 hex nuts. Using a small x-acto knife or similar, peel
transparent backing foil from the small heat spreaders. Apply to
CPU (apu1 and apu2 series) and south bridge (apu1 series only). Then peel the
blue cover foil from the heat
spreaders (shown removed on the right one).
Note: Please avoid unnecessary disassembly, the heat conductive pads are rather fragile. Please contact us if you need replacements. Spec for the thermal conductive pad: thickness 0.5 mm, thermal conductivity 6 W/mK or better. Due to the high power density of the CPU, pads with lower thermal conductivity will not work well.
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